Publikationen in Zeitschriften

73.“Strain enhenced chemical oxidation of silicon wafer”
S. Herold, J. Acker
Materials Science in Semiconductor Processing 135 (2021) 106105
72.“The Role of Molecular Hydrogen Formation in the Process of Metal-Ion Reduction on Multi-Crystalline Silicon in a Hydrofluoric Acid Matrix”
S. Schönekerl, J. Acker
Nanomaterials 11 (2020) 982
71.“Studies on the deposition of copper in lithium-ion batteries during the deep discharge process”
T. Langner, T. Sieber, J. Acker
Sci Rep 11, 6316 (2021)
70.“Lattice strain enhanced acidic etching on as cut sawn silicon wafer”
S. Herold, J. Acker
Materials Science in Semiconductor Processing 123 (2021) 105575
69.“The Kinetics and Stoichiometry of Metal Cation Reduction on Multi-Crystalline Silicon in a Dilute Hydrofluoric Acid Matrix”
S. Schönekerl, J. Acker
Nanomaterials 10 (2020) 2545
68.“Raman spectroscopic determination of the degree of dissociation in binary and ternary mixtures with HF and H2SiF6
T. Langner, A. Rietig, J. Acker
J Raman Spectrosc., 51 (2020) 366-372
67.“A revised model of silicon oxidation during the dissolution of silicon in HF/HNO3 mixtures”
A. Rietig, T. Langner, J. Acker
Phys. Chem. Chem. Phys., 21 (2019) 22002-22013
66.“A two-step acidic texturization procedure for the manufacture of low-reflective multi-crystalline silicon solar wafer”
B. Meinel, T. Langner, P. Preis, T. Sieber, E. Wefringhaus, J. Acker
Solar Energy 193 (2019) 395–402
65.“Measurement of the temperature dependence of lattice deformations in silicon using Raman microscopy”
S. Herold, J. Acker
J. Appl. Phys. 126, (2019) 035103
64.“Electroless deposited platinum antennas for wireless surface acoustic wave sensors”
E. Brachmann, M. Seifert, N. Neumann, N. Alshwawreh, M. Uhlemann, S. Menzel, J. Acker, S. Herold, V. Hoffmann, T. Gemming
Materials 12 (2019) 1002-1014
63.“Recovery of Li(Ni0.33Mn0.33Co0.33)O2 from Lithium-Ion Battery Cathodes: Aspects of Degradation”
T. Sieber, J. Ducke, A. Rietig, T. Langner, J. Acker
Nanomaterials 9(2), (2019) 246-259
62.“Etching shapes the topography of silicon wafers: Lattice-strain enhanced chemical reactivity of silicon for efficient solar cells”
T. Langner, T. Sieber, J. Acker
ACS Appl. Nano Mater. 1 (2018) 4135-4144
61.“Saw damage as an etch mask for the acidic texturization of multicrystalline silicon wafers”
J. Acker, T. Langner, B. Meinel, T. Sieber
Mat. Sci. Semicond. Proc. 74 (2018) 238-248
60.“Development and validation of a new method for the precise and accurate determination of trace elements in silicon by ICP-OES in high silicon matrices”
A. Rietig, J. Acker
J. Anal. At. Spectrom. 32 (2017) 322-333
59.“Chemical etching of Tungsten thin films for high-temperature surface acoustic wave-based sensor devices”
M. Spindler, S. Herold, J. Acker, E. Brachmann, S. Oswalda, S. Menzel, G. Rane, V. Hoffmann
Thin Solid Films 612 (2016) 322–326
58.“Impact of the chemical form of different fluorine sources on the formation of AlF molecules in a C2H2/N2O flame”
J. Acker, S. Bücker, V. Hoffmann
J. Anal. At. Spectrom. 31 (2016) 902-911
57."NMR investigation of boron impurities in refined metallurgical grade silicon"
H.-J. Grafe, W. Löser, S. Schmitz, M. Sakaliyska, S. Wurmehl,
S. Eisert, B. Reichenbach, J. Acker, A. Rietig, J. Ducke, T. Müller
Phys. Status Solidi A 212, No. 9 (2015) 2031–2036
56."The texturisation process during horizontal acidic etching of multi-crystalline silicon wafer"
B. Meinel, T. Koschwitz, R. Heinemann, J. Acker
Mat. Sci. Semicond. Proc. 26 (2014) 695-703
55."Determination of fluorine by molecular absorption spectrometry of AlF using a high-resolution continuum source spectrometer and a C2H2/N2O flame"
S. Bücker, V. Hoffmann, J. Acker
Current Analytical Chemistry 10 (2014) 426 - 434
54."The Formation of AlF Molecules and Al Atoms in a C2H2/N2O Flame Studied by Absorption and Emission Spectrometry of Molecules and Atoms"
J. Acker, S. Bücker, V. Hoffmann
Current Analytical Chemistry 10 (2014) 418-425
53."Comparison of diamond wire cut and silicon carbide slurry processed silicon wafer surfaces after acidic texturization"
B. Meinel, T. Koschwitz, C. Blocks, J. Acker
Materials Science in Semiconductor Processing 26 (2014) 93-100
52."HF/HNO3 etching of the saw damage"
J. Acker, T. Koschwitz, B. Meinel, R. Heinemann, C. Blocks
Energy Procedia 38 (2013) 223-233
51."Application of confocal microscopy to evaluate the morphology of acidic etched mc-silicon"
T. Koschwitz, B. Meinel, J. Acker
Energy Procedia 38 (2013) 234-242
50."Mass and Electron Balance for the Oxidation of Silicon during the Wet Chemical Etching in HF/HNO3 Mixtures"
J. Acker, A. Rietig, M. Steinert, V. Hoffmann
J. Phys. Chem. C 116 (2012) 20380-20388
49."Textural development of SiC and diamond wire sawed sc-silicon wafer"
B. Meinel, T. Koschwitz, J. Acker
Energy Procedia 27 (2012) 330-336
48."Spectrometric analysis of process etching solutions of the photovoltaic industry - Determination of HNO3, HF, and H2SiF6 using high-resolution continuum source absorption spectrometry of diatomic molecules and atoms"
S. Bücker, J. Acker
Talanta 94 (2012) 335-341
47."Analysis of gaseous reaction products of wet chemical silicon etching by conventional direct current glow discharge optical emission spectrometry (DC-GD-OES)"
V. Hoffmann, M. Steinert, J. Acker
J. Anal. At. Spectrom. 26 (2011) 1990-1996.
46."Influence of incorporated non-metallic impurities on electromigration in copper damascene interconnect lines"
M. Stangl, M. Lipták, J. Acker, V. Hoffmann, S. Baunack, K. Wetzig
Thin Solid Films 517 (2009) 2687-2690
45."New aspects on the reduction of nitric acid during wet chemical etching of silicon in concentrated HF/HNO3-mixtures"
M. Steinert, J. Acker, K. Wetzig
J. Phys. Chem. C 112 (2008) 14139-14144
44."Experimental and thermodynamic assessment of the Nb-Ni-Y system"
N. Mattern, M. Zinkevich, W. Löser, G. Behr, J. Acker
J. Phase Equilib. Diffus. 29 (2008) 141-155
43."Thermodynamic assessment of the copper catalyzed direct synthesis of methylchlorosilanes"
J. Acker, K. Bohmhammel
J. Organomet. Chem. 693 (2008) 2483-2493
42."Critical aspects on preparation of Bi-2223 glassy precursor by melt-process"
A. Nilsson, W. Gruner, J. Acker, K. Wetzig
J. Non-Cryst. Solids 354 (2008) 839-847
41."Structural behavior of CuxZr100-x metallic glass (x = 35-70)"
N. Mattern, A. Schöps, U. Kühn, J. Acker, O. Khvostikova, J. Eckert
J. Non-Cryst. Solids 354 (2008) 1054-1060
40."Influence of initial microstructure and impurities on Cu room-temperature recrystallization (self-annealing)"
M. Stangl, M. Liptak, A. Fletcher J. Acker, J. Thomas, H Wendrock, S. Oswald, K. Wetzig
Microelectronic Engineering 85 (2008) 534-541
39."Influence of Ta-based diffusion barriers on the microstructure of copper thin films"
M. Stangl, A. Fletcher J. Acker, H Wendrock, S. Oswald, K. Wetzig
J. Electronic Materials 36 (2007) 1625-1629
38."Glass-ceramic route of BSCCO superconductors - Fabrication of amorphous precursor"
A. Nilsson, W. Gruner, J. Acker, K. Wetzig
Physica C 460-462 (2007) 1331-1332
37."Purification-induced sidewall functionalization of magnetically pure single-walled carbon nanotubes"
R. Schönfelder, M.H. Rümmeli, W. Gruner, M. Löffler, J. Acker, V. Hoffmann, T. Gemming, B. Büchner, T. Pichler
Nanotechnology 18 (2007) 375601
36."Chemical analysis of acidic silicon etch solutions II: Determination of HNO3, HF, and H2SiF6 by ion chromatography"
J. Acker, A. Henßge
Talanta 72 (2007) 1540-1545
35."Chemical analysis of acidic silicon etch solutions I: Titrimetric determination of HNO3, HF, and H2SiF6"
A. Henßge, J. Acker
Talanta 73 (2007) 220-226
34."Phase formation of rapidly quenched Cu-Si alloys"
N. Mattern, R. Seyrich, L. Wilde, C. Baehtz, M. Knapp, J. Acker
J. Alloys Comp. 429 (2007) 211-215
33."Determination of fluoride in HNO3/ HF/ H2SiF6 etch solutions by new potentiometric titration methods"
W. Weinreich, J. Acker, I. Gräber
Talanta 71 (2007) 1901-1905
32."Study on the mechanism of silicon etching in HNO3-rich HF/HNO3 mixtures"
M. Steinert, J. Acker, S. Oswald, K. Wetzig
J. Phys. Chem. C, 111 (2007) 2133-2140
31."Determination of manganese valency in La1-xSrxMnO3 using ELNES in the (S)TEM"
T. Riedl, T. Gemming, W. Gruner, J. Acker, K. Wetzig
Micron 38 (2007) 224-230
30."Incorporation of sulfur, chlorine, and carbon into electroplated copper thin films"
M. Stangl, J. Acker, S. Oswald, M. Uhlemann, T. Gemming, S. Baunack, K. Wetzig
Microelectronic Engineering 84 (2007) 54-59
29."Segregation of organic impurities in thin electroplated Cu metallizations"
M. Stangl, J. Acker, V. Hoffmann, W. Gruner, K. Wetzig
Microchim. Acta, 156 (2007) 159-162
28."Sulfur incorporation in electroplated Cu(Ag) thin films"
S. Strehle, R. Reiche, V. Hoffmann, J. Acker, S. Menzel, T. Gemming, K. Wetzig
Microchim. Acta 156 (2006) 167-172
27."Tailoring the microstructure and mechanical properties of Ti-Al alloy using a novel electromagnetic stirring method"
K. Biswas, R. Hermann, J. Das, J. Priede, G. Gerbeth, J. Acker
Scripta Materialia 55 (2006) 1143-1146
26."Influence of melt convection on microstructure evolution of Nd-Fe-B alloys using forced cruicible rotation technique"
K. Biswas, R. Hermann, O. Filip, J. Acker, G. Gerbeth, J. Priede
Phys. Stat. Sol. C 3 (2006) 3277-3280
25."The effect of H2SiF6 on the surface morphology of textured multi-crystalline silicon"
W. Weinreich, J. Acker, I. Gräber
Semicond. Sci. Technol. 21 (2006) 1278-1286
24."Reactive species generated during wet chemical etching of silicon in HF / HNO3 mixtures"
M. Steinert, J. Acker, M. Krause, S. Oswald, K. Wetzig
J. Phys. Chem. B 110 (2006) 11377-11382
23."Structural effects on Zr substitution in the 1:7- and 2:17-type structure"
L. Schramm, J. Acker, K. Wetzig
J. Alloys. Comp. 414 (2006) 158-168
22."Titrimetric determination of silicon dissolved in concentrated HF-HNO3 etching solutions"
A. Henßge, J. Acker, C. Müller
Talanta 68 (2006) 581-585
21."Methods for the precise determination of the chemical composition of NaxCoO2 superconductors"
J. Acker, G. Krabbes
Analytical and Bioanalytical Chemistry 383 (2005) 1075-1081
20."Experimental studies on the mechanism of wet chemical etching of silicon in HF/HNO3 mixtures"
M. Steinert, J. Acker, A. Henßge, K. Wetzig
Journal of the Electrochemical Society 152 (2005) C843-C850
19."Characterization of electroplated copper self-annealing with investigations focused on incorporated impurities"
M. Stangl, J. Acker, V. Dittel, W. Gruner, V. Hoffmann, K. Wetzig
Microelectronic Engineering 82 (2005) 189-195
18."Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers"
M. Stangl, V. Dittel, J. Acker, V. Hoffmann, W. Gruner, K. Wetzig
Appl. Surf. Sci. 252 (2005) 158-161
17."Verhalten organischer Verunreinigungen in elektrochemisch abgeschiedenen Kupfermetallisierungsschichten während des self-annealings bei Raumtemperatur"
M. Stangl, J. Acker, V. Dittel, W. Gruner, V. Hoffmann, S. Oswald, K. Wetzig
Galvanotechnik 96 (2005) 1576-1579
16."Untersuchungen zum Einbau von Additiven in elektrochemisch abgeschiedenen Kupferschichten"
M. Stangl, J. Acker, A. Henßge, W. Gruner, V. Hoffmann, H. Wendrock, K. Wetzig
Galvanotechnik 96 (2005) 1084-1087
15."Stoichiometry dependence of superconductivity and microstructure in mechanically alloyed MgB2"
O. Perner, J. Eckert, W. Häßler, C. Fischer, J. Acker, T. Gemming, G. Fuchs, B. Holzapfel, L. Schultz
J. Appl. Phys. 97 (2005) 056105
14."Thermo-mechanical behavior and microstructural evolution of electrochemically deposited low-alloyed CuAg thin films"
S. Strehle, S. Menzel, H. Wendrock, J. Acker, T. Gemming, K. Wetzig
Microelectronic Engineering 76 (2004) 205-211
13.Influence of nitrogen content on the crystallization behavior of thin Ta-Si-N diffusion barriers"
R. Hübner, M. Hecker, N. Mattern, A. Voss, J. Acker, V. Hoffmann, K. Wetzig, H.-J. Engelmann, E. Zschech, H. Heuer, Ch. Wenzel
Thin Solid Films 468 (2004) 183-192
12."The reactivity in the system Cu-Si-Cl related to the activation of silicon in the Direct Synthesis"
J. Acker, S. Köther, K.M. Lewis, K. Bohmhammel
Silicon Chemistry 2 (2003) 195-206
11."Compensation effect in trichlorosilane synthesis"
J. Acker, K. Bohmhammel
J. Organomet. Chem. 686 (2003) 151-157
10."Microstructural investigation of electrodeposited CuAg-thin films"
S. Strehle, S. Menzel, H. Wendrock, J. Acker, K. Wetzig
Microelectronic Engineering 70 (2003) 506-511
9.Study of the (001) cleavage planes of guanidinium methane sulfonate crystals by AFM and He diffraction"
G. Bracco, Y. Hu, J. Acker, M.D. Ward
Appl. Surf. Sci. 212 (2003) 151-156
8."He diffraction study of organic single-crystal surfaces: Hydrogen-bonded and methyl-terminated (001) cleavage planes of a guanidinium methane sulfonate crystal"
G. Bracco, J. Acker, M.D. Ward, G. Scoles
Langmuir 18 (2002) 5551-5557
7."Reactivity of intermetallic compounds: A solid state approach to direct reactions of silicon"
J. Acker, K. Bohmhammel
J. Phys. Chem. B 106 (2002) 5105-5117
6."Synthesis of nanocrystalline silicon in the system La-Si-H-Cl: Thermoanalytical investigations"
E. Henneberg, J. Acker, I. Röver, G. Roewer, K. Bohmhammel
Thermochim. Acta 382 (2002) 297-301
5."Formation of transition metal silicides by solid-gas reactions: Thermodynamic and kinetic considerations"
J. Acker, I. Röver, R. Otto, G. Roewer, K. Bohmhammel
Solid State Ionics 141-142 (2001) 583-591
4."Synthesis of silicon nanoclusters by solid-gas reaction"
J. Acker, K. Bohmhammel, E. Henneberg, G. Irmer, I. Röver, G. Roewer
Adv. Mater. 12 (2000) 1605-1610
3."Optimization of thermodynamic data in the Ni-Si system"
J. Acker, K. Bohmhammel
Thermochimica Acta 337 (1999) 187-193
2."Thermodynamic properties of the nickel silicide NiSi between 8 and 400 K"
J. Acker, G.J.K. van den Berg, K. Bohmhammel, Ch. Kloc, J.C. van Miltenburg
Thermochimica Acta 339 (1999) 29-33
1."Thermodynamic properties of iron silicides FeSi and alpha- FeSi2"
J. Acker, G.J.K. van den Berg, K. Bohmhammel, Ch. Kloc, J.C. van Miltenburg
J. Chem. Thermodynamics 31 (1999) 1523-1536

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