We explore the following:

• Concepts for scalability of RF transceiver architectures with integrated antennas, especially for (massive) MIMO communication and MIMO radar at RF/microwave, mmWave and THz frequencies
• New RF packaging architectures (e.g. based on die/chip embedding) for heterogeneous system integration of antennas and RF front-end components with beamforming capabilities for communication, radar sensing as well as for joint communication and radar sensing (JCAS)
• Chip-package-antenna co-design and co-optimization methods, considering single-ended and differential RF front-end ICs
• Design methods and measures for improved isolation and prevention/minimization of self-interference between integrated transmit and receive antennas as well as between RF front-end components