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Module Number:
| 14320
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| Module Title: | Signal/Power Integrity and Electromagnetic Compatibility |
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Signal-/Powerintegrität und Elektromagnetische Verträglichkeit
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| Department: |
Faculty 1 - Mathematics, Computer Science, Physics, Electrical Engineering and Information Technology
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| Responsible Staff Member: | -
Prof. Dr.-Ing. Dr.-Ing. habil. Ndip, Ivan
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| Language of Teaching / Examination: | English |
| Duration: | 1 semester |
| Frequency of Offer: |
Every summer semester
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| Credits: |
6
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| Learning Outcome: | After successfully completing the module, students will be acquainted with a) root causes of signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC) issues in electronic systems, b) basic electromagnetic field and circuit concepts for analysis of SI, PI and EMC issues, especially in electronic packaging for radio frequency (RF) and high-speed systems. |
| Contents: | - Introduction to signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC)
- Signal distribution networks (SDNs) and power delivery networks (PDNs) in electronic systems
- Role of electronic packaging and heterogeneous integration technologies on signal and power integrity (SIPI) and EMC
- Basic electromagnetic field and circuit theories for SIPI and EMC
- SI: Analysis of single-ended and differential signal paths of SDNs
- PI: Analysis of impedance, inductance and capacitance of PDNs
- EMC: Analysis of coupling and undesired radiation
- EMC & SIPI: Introduction to design methodologies for SIPI and EMC
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| Recommended Prerequisites: | None |
| Mandatory Prerequisites: | None |
| Forms of Teaching and Proportion: | -
Lecture
/ 2 Hours per Week per Semester
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Exercise
/ 2 Hours per Week per Semester
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Self organised studies
/ 120 Hours
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| Teaching Materials and Literature: | - Stephen H. Hall, Howard L. Heck: Advanced Signal Integrity for High-Speed Digital Designs, Wiley 2009
- Paul G. Huray: The Foundations of Signal Integrity, Wiley, 2009
- Clayton Paul: Introduction to Electromagnetic Compatibility, Wiley, 2006
- Larry D. Smith, Eric Bogatin: Principles of Power Integrity for PDN Design-Simplified: Robust and Cost Effective Design for High Speed Digital Products, Prentice Hall, 2017
- Madhavan Swaminathan, Ege Engin: Power Integrity Modeling and Design for Semiconductors and Systems, Prentice Hall, 2007
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| Module Examination: | Final Module Examination (MAP) |
| Assessment Mode for Module Examination: | - Oral exam, 30-45 min. OR
- Written exam, 90 min.
In the first lectures it will be announced whether the examination will be conducted in written or oral form. |
| Evaluation of Module Examination: | Performance Verification – graded |
| Limited Number of Participants: | None |
| Part of the Study Programme: | -
Master (research-oriented) /
Elektrotechnik /
PO 2019
- 1. SÄ 2020
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Master (research-oriented) /
Elektrotechnik /
PO 2023
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Master (research-oriented) /
Micro- and Nanoelectronics /
PO 2024
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Master (research-oriented) /
Physics /
PO 2021
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Master (research-oriented) /
Wirtschaftsingenieurwesen /
PO 2019
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| Remarks: | - Study programme Physics M.Sc.: Compulsory elective module in complex „Minor Subject“
- Study programme Micro- and Nanoelectronics M.Sc.: Compulsory elective module in complex „Circuit Design”
If required, all concepts in the lectures of this module can also be explained in German. Please speak to the professor responsible. |
| Module Components: | - Lecture: Signal/Power Integrity and Electromagnetic Compatibility
- Exercise to the lecture
- Related examination
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| Components to be offered in the Current Semester: | |
