Undulator- Beam line U49/2- PGM2 at BESSY 2 Details

UHV-Spectro-microscopydraft of the system

• XPS/UPS Details
• PEEM (Photo Emission Electronen Microscopy) Details
• NEXAFS-Spectroscopy chamber for ulra-heigh vacuum (UHV)
• Combined AFM-STM (Omicron) for measurements in UHV

Spectroscopy

• FTIR (Fourier Transform Infraret Spectrometer) FTS 60B (Bio Rad) Details

Microscpoy 

• Atomic Force Microscope (AFM) Details
• Interference Microscope Epival Interphako (Carl Zeiss) Details
• Reflected-Light Microscope Epityp (Carl Zeiss) Details
• MicroViewer (Kappa) (Video Microscope 1000 times Magnification)

Layer Deposition and Surface Treatment

• ALD: (in-situ)2
• CVD of SiC Layers Details
• Surface Treatment of Si Layers Details
• Glove-Box for the Fabrication of Organic Layers in oxygen free atmosphere Details

Catalysis

• Flow Reactor (atmospheric pressure) for the Methanisation of CO2 (Sabatier-Reaction)

Sensors

• Sensor Test Station Details
• Deposition Equipment for Sensors (Airbrush, Spin Coating, Plotting) Details
• Set-up for IV Measurements on Sensor Layers

Electrical Characterization

• Oscilloscop HP 54616 (500 MHz, 2 Gsa/s, single shot)
• Generators, Frequency Counter, Multimeter, Power Supplies (HP, Hameg, Keithley, Prema)
• LCR-Meter Agilent 4284A, LCR-817 (instek)
• Network Analyzer Agilent E5100A
• CV Set-Up, IV Set-up

Further Equipment

• Pyrometer (Temperature Recording ) Modline plus icron 400-1200°C
• Thickness Measurement System Talystep (Rank Taylor Hobson) Details