specializes in industry-oriented applied research. It develops assembly and interconnection technology, also known as electronic packaging. Our technologies connect the individual components, protect components and devices from vibration and moisture, and reliably dissipate heat. Fraunhofer IZM thus ensures that electronic devices continue to function reliably in even the harshest conditions. The institute, founded in 1993, has a staff of nearly 400 and disposes of a lab area of more than 8,000 sqm.